{"id":5144,"date":"2026-04-14T18:22:55","date_gmt":"2026-04-14T11:22:55","guid":{"rendered":"https:\/\/hadupack.com\/?p=5144"},"modified":"2026-09-23T08:28:17","modified_gmt":"2026-09-23T01:28:17","slug":"thiec-han","status":"publish","type":"post","link":"https:\/\/hadupack.com\/en\/thiec-han\/","title":{"rendered":"Solder &#8211; Solder wire &#8211; Solder bar &#8211; Solder paste"},"content":{"rendered":"<p><\/p>\n<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_51_1 counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title \" >Table of Contents<\/p>\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\" role=\"button\"><label for=\"item-6ae02a7533b8e\" ><span class=\"\"><span style=\"display:none;\">Toggle<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #999;color:#999\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/label><input aria-label=\"Toggle\" aria-label=\"item-6ae02a7533b8e\"  type=\"checkbox\" id=\"item-6ae02a7533b8e\"><\/a><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1 eztoc-visibility-hide-by-default' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#What_is_solder\" title=\"What is solder?\">What is solder?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#Core_concepts_and_characteristics_of_solder\" title=\"Core concepts and characteristics of solder\">Core concepts and characteristics of solder<\/a><ul class='ez-toc-list-level-3'><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#Common_types_of_solder\" title=\"Common types of solder\">Common types of solder<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#Solder_applications\" title=\"Solder applications\">Solder applications<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#Solder_production_process\" title=\"Solder production process\">Solder production process<\/a><ul class='ez-toc-list-level-3'><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#1_Core_process_of_solder_production\" title=\"1. Core process of solder production\">1. Core process of solder production<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#2_Types_and_main_characteristics_of_soldering_materials\" title=\"2. Types and main characteristics of soldering materials\">2. Types and main characteristics of soldering materials<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#3_Key_factors_in_the_production_process\" title=\"3. Key factors in the production process\">3. Key factors in the production process<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#Incompatible_composition\" title=\"Incompatible composition:\">Incompatible composition:<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#Excessive_impurities\" title=\"Excessive impurities:\">Excessive impurities:<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#Physical_defects\" title=\"Physical defects:\">Physical defects:<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#Forming_and_processing_issues\" title=\"Forming and processing issues:\">Forming and processing issues:<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#Common_soldering_defects_SMTPCBA\" title=\"Common soldering defects (SMT\/PCBA)\">Common soldering defects (SMT\/PCBA)<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#Tips_for_storing_solder\" title=\"Tips for storing solder\">Tips for storing solder<\/a><ul class='ez-toc-list-level-3'><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#Soldering_adhesive\" title=\"Soldering adhesive\">Soldering adhesive<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#Solder_wire\" title=\"Solder wire\">Solder wire<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#Precautions_when_using_solder\" title=\"Precautions when using solder\">Precautions when using solder<\/a><ul class='ez-toc-list-level-3'><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#I_Safety_and_Environmental_Protection_Most_Important\" title=\"I. Safety and Environmental Protection (Most Important)\">I. Safety and Environmental Protection (Most Important)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#II_Soldering_Techniques_Tool_Operation\" title=\"II. Soldering Techniques (Tool Operation)\">II. Soldering Techniques (Tool Operation)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/hadupack.com\/en\/thiec-han\/#III_Storage_of_solder_and_soldering_flux\" title=\"III. Storage of solder and soldering flux\u00a0\">III. Storage of solder and soldering flux\u00a0<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2><span class=\"ez-toc-section\" id=\"What_is_solder\"><\/span><span style=\"color: #008000; font-size: 14pt;\"><em><strong>What is solder?<\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><span style=\"font-size: 14pt;\">Solder is an alloy with a low melting point used to join metal components. During soldering, it melts and fills the joint, and after cooling, it connects the parts and conducts electricity. Its melting point must be lower than that of the metal being soldered.<\/span><\/p>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5157\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-8.jpg\" alt=\"\" width=\"1600\" height=\"1200\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-8.jpg 1600w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-8-768x576.jpg 768w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-8-1536x1152.jpg 1536w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-8-400x300.jpg 400w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-8-300x225.jpg 300w\" sizes=\"auto, (max-width: 767px) 89vw, (max-width: 1000px) 54vw, (max-width: 1071px) 543px, 580px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p><span style=\"font-size: 14pt;\">It is commonly used in the electronics industry to secure components onto circuit boards. Solder is classified as leaded solder (e.g.: Sn63-Pb37) and lead-free solder, and common forms include solder wire, solder paste and solder bars.<\/span><\/p>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5149\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-1.jpg\" alt=\"\" width=\"1000\" height=\"667\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-1.jpg 1000w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-1-768x512.jpg 768w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-1-300x200.jpg 300w\" sizes=\"auto, (max-width: 767px) 89vw, (max-width: 1000px) 54vw, (max-width: 1071px) 543px, 580px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p><span style=\"font-size: 14pt;\"><span style=\"color: #0000ff;\">\u25c6<\/span>Learn more:<\/span><\/p>\n<ol>\n<li><span style=\"color: #ff00ff; font-size: 14pt;\"><a style=\"color: #ff00ff;\" href=\"https:\/\/hadupack.com\/danh-muc\/vat-tu-phong-sach\/\">https:\/\/hadupack.com\/danh-muc\/vat-tu-phong-sach\/<\/a><\/span><\/li>\n<li><span style=\"color: #0000ff; font-size: 14pt;\"><a style=\"color: #0000ff;\" href=\"https:\/\/hadupack.com\/san-pham\/quat-thoi-ion\/\">https:\/\/hadupack.com\/san-pham\/quat-thoi-ion\/<\/a><\/span><\/li>\n<li><span style=\"color: #00ccff; font-size: 14pt;\"><a style=\"color: #00ccff;\" href=\"https:\/\/hadupack.com\/san-pham\/sung-thoi-ion\/\">https:\/\/hadupack.com\/san-pham\/sung-thoi-ion\/<\/a><\/span><\/li>\n<\/ol>\n<h2><span class=\"ez-toc-section\" id=\"Core_concepts_and_characteristics_of_solder\"><\/span><span style=\"color: #008000; font-size: 14pt;\"><em><strong>Core concepts and characteristics of solder<\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h2>\n<ol>\n<li><span style=\"font-size: 14pt;\">Definition and function: During the soldering process, solder connects the materials of electronic components by melting the metal, forming circuit paths.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Technical point: Solder must have good &#8220;wetting&#8221; properties, covering and bonding with the base material.<\/span><br \/>\n<span style=\"font-size: 14pt;\">Solder classification:<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Soft solder (Soldering): Melting point is usually below 450 degrees C, commonly used for soldering electronic components.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Hard solder (Copper soldering): Melting point is higher (&gt; 450 degrees C), used in applications requiring a more robust structure.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Main composition: Traditionally, it is a tin-lead alloy ( Sn63 &#8211; Pb37) (e.g.: melting point 183 degrees C). To comply with the EU RoHS directive, most modern solders are lead-free.<\/span><\/li>\n<\/ol>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5155\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-6.jpg\" alt=\"\" width=\"720\" height=\"556\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-6.jpg 720w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-6-300x232.jpg 300w\" sizes=\"auto, (max-width: 720px) 100vw, 720px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h3><span class=\"ez-toc-section\" id=\"Common_types_of_solder\"><\/span><span style=\"font-size: 14pt;\"><em><span style=\"color: #ff0000;\">Common types of solder<\/span><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h3>\n<ol>\n<li><span style=\"font-size: 14pt;\">Solder wire: Wire-shaped, commonly used for manual soldering.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Solder paste: Solder in powder form mixed with flux, commonly used in SMT (Surface Mount Technology).<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Solder bar: Commonly used in wave soldering or dip soldering.<\/span><\/li>\n<\/ol>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5160\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-3.jpg\" alt=\"\" width=\"612\" height=\"612\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-3.jpg 612w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-3-100x100.jpg 100w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-3-300x300.jpg 300w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-3-150x150.jpg 150w\" sizes=\"auto, (max-width: 612px) 100vw, 612px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h3><span class=\"ez-toc-section\" id=\"Solder_applications\"><\/span><span style=\"color: #ff0000; font-size: 14pt;\"><em><strong>Solder applications<\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h3>\n<ol>\n<li><span style=\"font-size: 14pt;\"><em><strong>Electronics manufacturing: Packaging and connecting printed circuit board (PCB) components.<\/strong><\/em><\/span><\/li>\n<li><span style=\"font-size: 14pt;\"><em><strong>Metalworking: Soldering precision parts and tubes.<\/strong><\/em><\/span><\/li>\n<\/ol>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5150\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-2.jpg\" alt=\"\" width=\"880\" height=\"383\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-2.jpg 880w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-2-768x334.jpg 768w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-2-300x131.jpg 300w\" sizes=\"auto, (max-width: 767px) 89vw, (max-width: 1000px) 54vw, (max-width: 1071px) 543px, 580px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h2><span class=\"ez-toc-section\" id=\"Solder_production_process\"><\/span><span style=\"color: #008000; font-size: 14pt;\"><em><strong>Solder production process<\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><span style=\"font-size: 14pt;\">The main solder production processes include melting raw materials, alloying, forming (such as grinding into powder, extruding into wire, or preliminary forming), and inspection, with the aim of producing high-purity tin-based alloys (Sn-Ag-Cu, Sn-Pb, etc.) with precise compositions. These materials are widely used in soft soldering technology for electronic packaging.<\/span><\/p>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5156\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-7.jpg\" alt=\"\" width=\"941\" height=\"1200\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-7.jpg 941w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-7-768x979.jpg 768w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-7-300x383.jpg 300w\" sizes=\"auto, (max-width: 767px) 89vw, (max-width: 1000px) 54vw, (max-width: 1071px) 543px, 580px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h3><span class=\"ez-toc-section\" id=\"1_Core_process_of_solder_production\"><\/span><span style=\"color: #ff0000; font-size: 14pt;\"><em><strong>1. Core process of solder production<\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h3>\n<ol>\n<li><span style=\"font-size: 14pt;\">Preparation and melting of raw materials: In a high-purity environment, tin, silver, copper, bismuth and other metal raw materials are precisely measured and melted in a furnace.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Alloying and refining: Ensure a uniform composition in the molten state and carry out refining to remove impurities.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Powdering (for solder paste): Using atomization technology, the liquid alloy is formed into ultra-fine spherical powder.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Extrusion and wire drawing (for solder wire): The alloy ingot is heated and extruded into rough rods, then continuously drawn into fine solder wire.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Formed solder materials: Solder materials are processed into specific shapes (sheets, rings, etc.) to provide precise solder quantities.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Adding flux: Resin or chemical flux is often added to solder wire to enhance wettability.<\/span><\/li>\n<\/ol>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5158\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-1.jpg\" alt=\"\" width=\"1920\" height=\"1920\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-1.jpg 1920w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-1-768x768.jpg 768w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-1-1536x1536.jpg 1536w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-1-100x100.jpg 100w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-1-300x300.jpg 300w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-1-150x150.jpg 150w\" sizes=\"auto, (max-width: 767px) 89vw, (max-width: 1000px) 54vw, (max-width: 1071px) 543px, 580px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h3><span class=\"ez-toc-section\" id=\"2_Types_and_main_characteristics_of_soldering_materials\"><\/span><span style=\"font-size: 14pt;\"><em><strong><span style=\"color: #ff0000;\">2. Types and main characteristics of soldering materials<\/span><\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h3>\n<ol>\n<li><span style=\"font-size: 14pt;\">Lead-containing solder (Sn-Pb): A common ratio is Sn63Pb37 (eutectic solder), with a melting point of 183 degrees C, good workability but toxic.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Lead-free solder: To comply with RoHS regulations, commonly used alloys include the Sn-Ag-Cu (SAC) series, with a higher melting point (approximately 217 degrees C &#8211; 220 degrees C), requiring stricter process control.<\/span><\/li>\n<\/ol>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5159\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-2.jpg\" alt=\"\" width=\"1080\" height=\"1080\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-2.jpg 1080w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-2-768x768.jpg 768w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-2-100x100.jpg 100w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-2-300x300.jpg 300w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-2-150x150.jpg 150w\" sizes=\"auto, (max-width: 767px) 89vw, (max-width: 1000px) 54vw, (max-width: 1071px) 543px, 580px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h3><span class=\"ez-toc-section\" id=\"3_Key_factors_in_the_production_process\"><\/span><span style=\"font-size: 14pt;\"><em><strong><span style=\"color: #ff0000;\">3. Key factors in the production process<\/span><\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h3>\n<ol>\n<li><span style=\"font-size: 14pt;\">Accurate component ratios: Ensure the melting point and mechanical properties meet requirements.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Impurity control: Strictly control the content of metal impurities to improve reliability.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Particle size distribution (solder powder): Control the particle size of solder powder for different printing processes.<\/span><\/li>\n<\/ol>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5151\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-3.jpg\" alt=\"\" width=\"800\" height=\"800\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-3.jpg 800w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-3-768x768.jpg 768w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-3-100x100.jpg 100w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-3-300x300.jpg 300w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-3-150x150.jpg 150w\" sizes=\"auto, (max-width: 767px) 89vw, (max-width: 1000px) 54vw, (max-width: 1071px) 543px, 580px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p><span style=\"color: #008000; font-size: 14pt;\"><em><strong>Common Problems in Solder Production<\/strong><\/em><\/span><\/p>\n<p><span style=\"font-size: 14pt;\">The common problems in solder production mainly occur during the melting and forming stages. They include poor wettability due to metal composition not meeting specifications, excessively high levels of harmful impurities (such as iron and copper) affecting solder joint reliability, as well as porosity, cold solder joints, and oxide inclusions generated during the forming process. These problems directly affect the mechanical strength, electrical properties, and appearance quality of solder joints. Common problems in solder production:<\/span><\/p>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5161\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thanh-han-1.jpg\" alt=\"\" width=\"720\" height=\"659\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thanh-han-1.jpg 720w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thanh-han-1-300x275.jpg 300w\" sizes=\"auto, (max-width: 720px) 100vw, 720px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h3><span class=\"ez-toc-section\" id=\"Incompatible_composition\"><\/span><span style=\"color: #ff0000; font-size: 14pt;\"><em><strong>Incompatible composition:<\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h3>\n<ol>\n<li><span style=\"font-size: 14pt;\">Incorrect tin content in lead-free solder: The composition of lead-free solder (such as SAC305) is extremely sensitive to temperature. Uneven composition can lead to an increased melting point or poor wettability.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Lead contamination: Lead contamination in the lead-free solder production line can cause serious quality issues (RoHS violations).<\/span><\/li>\n<\/ol>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5170\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-002.jpg\" alt=\"\" width=\"1200\" height=\"1200\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-002.jpg 1200w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-002-768x768.jpg 768w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-002-100x100.jpg 100w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-002-300x300.jpg 300w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-002-150x150.jpg 150w\" sizes=\"auto, (max-width: 767px) 89vw, (max-width: 1000px) 54vw, (max-width: 1071px) 543px, 580px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h3><span class=\"ez-toc-section\" id=\"Excessive_impurities\"><\/span><span style=\"color: #ff0000; font-size: 14pt;\"><em><strong>Excessive impurities:<\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h3>\n<ol>\n<li><span style=\"font-size: 14pt;\">Iron (Fe) and copper (Cu) contamination: Iron and copper dissolved from the melting pot or tools during the melting process can increase the brittleness of the solder, form ice crystals, and cause a rough solder joint surface.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Oxide impurities: When exposed to air in the molten state, tin oxides readily form, affecting the solder&#8217;s flow and adhesion.<\/span><\/li>\n<\/ol>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5162\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thanh-han-2.jpg\" alt=\"\" width=\"800\" height=\"800\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thanh-han-2.jpg 800w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thanh-han-2-768x768.jpg 768w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thanh-han-2-100x100.jpg 100w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thanh-han-2-300x300.jpg 300w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thanh-han-2-150x150.jpg 150w\" sizes=\"auto, (max-width: 767px) 89vw, (max-width: 1000px) 54vw, (max-width: 1071px) 543px, 580px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h3><span class=\"ez-toc-section\" id=\"Physical_defects\"><\/span><span style=\"color: #ff0000; font-size: 14pt;\"><em><strong>Physical defects:<\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h3>\n<ol>\n<li><span style=\"font-size: 14pt;\">Porosity\/Pinholes: Improper control of the cooling rate after melting, or the presence of volatile substances in the solder itself, can lead to internal porosity in the solder rods, affecting electrical conductivity and structural strength.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Impurities: Incomplete removal of oxide residues after melting, which are directly deposited into the solder rods, causing cold solder joints during soldering.<\/span><\/li>\n<\/ol>\n<h3><span class=\"ez-toc-section\" id=\"Forming_and_processing_issues\"><\/span><span style=\"color: #ff0000; font-size: 14pt;\"><em><strong>Forming and processing issues:<\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h3>\n<ol>\n<li><span style=\"font-size: 14pt;\">Poor solder rod appearance: Darkened, oxidized, severely segregated surfaces, affecting customer confidence.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Dimensional accuracy errors: Uneven diameter\/size of solder wire or solder rods, affecting feeding in automated production.<\/span><\/li>\n<\/ol>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5163\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-01.jpg\" alt=\"\" width=\"750\" height=\"246\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-01.jpg 750w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-01-300x98.jpg 300w\" sizes=\"auto, (max-width: 706px) 89vw, (max-width: 767px) 82vw, 740px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h3><span class=\"ez-toc-section\" id=\"Common_soldering_defects_SMTPCBA\"><\/span><span style=\"color: #ff0000; font-size: 14pt;\"><em><strong>Common soldering defects (SMT\/PCBA)<\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h3>\n<p><span style=\"font-size: 14pt;\">Common issues encountered during the use of solder include:<\/span><\/p>\n<ol>\n<li><span style=\"font-size: 14pt;\">Bridging: Two solder joints are connected, usually due to an excessive amount of solder. &#8220;Tombstoning&#8221;: Uneven wetting forces at both ends of the component cause one end to lift up.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Cold Joint: The solder moves before melting or cools completely, resulting in a weak solder joint structure.<\/span><\/li>\n<\/ol>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5152\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-4.jpg\" alt=\"\" width=\"800\" height=\"450\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-4.jpg 800w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-4-768x432.jpg 768w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-4-300x169.jpg 300w\" sizes=\"auto, (max-width: 767px) 89vw, (max-width: 1000px) 54vw, (max-width: 1071px) 543px, 580px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h2><span class=\"ez-toc-section\" id=\"Tips_for_storing_solder\"><\/span><span style=\"color: #008000; font-size: 14pt;\"><em><strong>Tips for storing solder<\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><span style=\"font-size: 14pt;\">Solder paste must be stored in a refrigerator at a temperature of 0-10\u00b0C, tightly sealed to prevent oxidation and deterioration. Before use, let the paste warm up to room temperature and avoid turning upside down solder paste bottles with pointed tips. Solder wire should be stored in a dry place at room temperature, away from high temperatures and humidity. Points to note when storing:<\/span><\/p>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5169\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-001.jpg\" alt=\"\" width=\"1600\" height=\"1600\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-001.jpg 1600w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-001-768x768.jpg 768w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-001-1536x1536.jpg 1536w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-001-100x100.jpg 100w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-001-300x300.jpg 300w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-001-150x150.jpg 150w\" sizes=\"auto, (max-width: 767px) 89vw, (max-width: 1000px) 54vw, (max-width: 1071px) 543px, 580px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h3><span class=\"ez-toc-section\" id=\"Soldering_adhesive\"><\/span><span style=\"color: #ff0000; font-size: 14pt;\"><em><strong>Soldering adhesive<\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h3>\n<ol>\n<li><span style=\"font-size: 14pt;\">Temperature: The cold storage temperature is 0\u00b0C &#8211; 10\u00b0C, do not freeze (unless explicitly permitted in the product instructions).<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Environment: Keep tightly sealed and store in a dry, well-ventilated, cool place.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Warming: Allow the adhesive to warm to room temperature for 2-4 hours before use to prevent condensation.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Storage method: For syringes or bottles of soldering adhesive, it is recommended to store them with the pointed tip facing downward.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Shelf life: Normally, the shelf life is 6 months when tightly sealed and refrigerated. Use within 24 hours after opening.<\/span><\/li>\n<\/ol>\n<h3><span class=\"ez-toc-section\" id=\"Solder_wire\"><\/span><span style=\"color: #ff0000; font-size: 14pt;\"><em><strong>Solder wire<\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h3>\n<ol>\n<li><span style=\"font-size: 14pt;\">Environment: Store in a dry, well-ventilated place at room temperature.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Avoid: High temperatures and direct sunlight to prevent oxidation. <\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Precaution: Check the refrigerator temperature regularly.<\/span><\/li>\n<\/ol>\n<p><span style=\"font-size: 14pt;\">If exposed to extremely low temperatures below -13.2\u00b0C for a prolonged period, the solder may turn into gray solder powder. Pay particular attention to the storage ambient temperature.<\/span><\/p>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5154\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-5.jpg\" alt=\"\" width=\"900\" height=\"600\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-5.jpg 900w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-5-768x512.jpg 768w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-5-300x200.jpg 300w\" sizes=\"auto, (max-width: 767px) 89vw, (max-width: 1000px) 54vw, (max-width: 1071px) 543px, 580px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h2><span class=\"ez-toc-section\" id=\"Precautions_when_using_solder\"><\/span><span style=\"color: #008000; font-size: 14pt;\"><em><strong>Precautions when using solder<\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><span style=\"font-size: 14pt;\">Safety is just as important as technique when using solder. Always wear safety goggles and gloves, and use a fume extractor to avoid inhaling toxic fumes. Soldering technique should follow the steps &#8220;preheat &#8211; apply solder &#8211; remove solder &#8211; cool&#8221; to ensure a complete solder joint. At the same time, the temperature of the soldering tool should be set at around 300 degrees C (more precise temperature control is required for lead-free solder) to reduce oxidation. Detailed precautions for use are as follows:<\/span><\/p>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5164\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-02.jpg\" alt=\"\" width=\"1388\" height=\"1180\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-02.jpg 1388w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-02-768x653.jpg 768w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thiec-han-02-300x255.jpg 300w\" sizes=\"auto, (max-width: 767px) 89vw, (max-width: 1000px) 54vw, (max-width: 1071px) 543px, 580px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h3><span class=\"ez-toc-section\" id=\"I_Safety_and_Environmental_Protection_Most_Important\"><\/span><span style=\"color: #ff0000; font-size: 14pt;\"><em><strong>I. Safety and Environmental Protection (Most Important)<\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h3>\n<ol>\n<li><span style=\"font-size: 14pt;\">Personal protection: Welding produces toxic fumes containing heavy metals such as lead and cadmium. Always wear a mask, safety goggles, and gloves.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Environmental ventilation: The welding area must have professional fume extraction equipment; never work in an enclosed space.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Fire prevention and firefighting: Ensure the work area is clean and place a fire-resistant mat to prevent welding sparks from flying out.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Hygiene habits: Wash your hands thoroughly after working; eating and drinking in the welding environment are strictly prohibited.<\/span><\/li>\n<\/ol>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5166\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thanh-han-3.jpg\" alt=\"\" width=\"800\" height=\"534\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thanh-han-3.jpg 800w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thanh-han-3-768x513.jpg 768w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/thanh-han-3-300x200.jpg 300w\" sizes=\"auto, (max-width: 767px) 89vw, (max-width: 1000px) 54vw, (max-width: 1071px) 543px, 580px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h3><span class=\"ez-toc-section\" id=\"II_Soldering_Techniques_Tool_Operation\"><\/span><span style=\"color: #ff0000; font-size: 14pt;\"><em><strong>II. Soldering Techniques (Tool Operation)<\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h3>\n<ol>\n<li><span style=\"font-size: 14pt;\">Temperature control: The temperature must not be too high. Lead-based solder has a temperature of approximately 250 degrees C &#8211; 300 degrees C, while lead-free solder usually requires a higher temperature and good thermal recovery capability, typically above 300 degrees C<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Four soldering steps: Preheating (the soldering iron tip contacts the soldering point and lead), applying solder (the solder contacts the heated area), removing (removing the solder wire), cooling (solidifying the solder joint).<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Prevent oxidation: Avoid prolonged exposure to 400 degrees C to prevent rapid oxidation of the soldering iron tip and poor solder adhesion.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Avoid cold solder joints: Ensure that the components are completely covered with solder to prevent rough surfaces or incomplete solder joints.<\/span><\/li>\n<\/ol>\n<table style=\"border-collapse: collapse; width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 100%;\"><span style=\"font-size: 14pt;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-5168\" src=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-04.jpg\" alt=\"\" width=\"750\" height=\"800\" srcset=\"https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-04.jpg 750w, https:\/\/hadupack.com\/wp-content\/uploads\/2026\/04\/kem-han-04-300x320.jpg 300w\" sizes=\"auto, (max-width: 706px) 89vw, (max-width: 767px) 82vw, 740px\" \/><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h3><span class=\"ez-toc-section\" id=\"III_Storage_of_solder_and_soldering_flux\"><\/span><span style=\"color: #ff0000; font-size: 14pt;\"><em><strong>III. Storage of solder and soldering flux\u00a0<\/strong><\/em><\/span><span class=\"ez-toc-section-end\"><\/span><\/h3>\n<ol>\n<li><span style=\"font-size: 14pt;\">Environmental control: Solder paste should be stored in a refrigerator at a temperature between 2\u00b0C and 5\u00b0C. The solder paste must be warmed to room temperature for at least 4 hours before use.<\/span><\/li>\n<li><span style=\"font-size: 14pt;\">Inspection type: Select soldering materials that meet the required standards (leaded or lead-free) according to the soldering requirements.<\/span><\/li>\n<\/ol>\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>What is solder? Solder is an alloy with a low melting point used to join metal components. During soldering, it melts and fills the joint, and after cooling, it connects the parts and conducts electricity. Its melting point must be lower than that of the metal being soldered. 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